NVSU333A Nichia LED

NVSU333A Nichia LED

Pb-free Reflow Soldering Application
Built-in ESD Protection Device
RoHS Compliant

Forward Current IF 4500 mA
Pulse Forward Current IFP 6000 mA
Allowable Reverse Current IR 85 mA
Power Dissipation PD 18.9 W
Operating Temperature Topr -10~85
Storage Temperature Tstg -40~100
Junction Temperature TJ 100

This LED is designed to be reflow soldered to a PCB. If dip soldered or hand soldered, Nichia will not guarantee its reliability.

• Reflow soldering must not be performed more than twice.
• When the LEDs are cooled from the peak reflow temperature, ensure that the cooling is performed very gradually to avoid
  excessive stress on the LED (e.g. causing cracks in the solder joints). Ensure that sufficient preliminary verification is performed
  to ensure that there are no issues with the chosen reflow soldering conditions/process.
• During reflow soldering, the heat and atmosphere in the reflow oven may cause the optical characteristics to degrade. In particular,
  reflow soldering performed with an air atmosphere may have a greater negative effect on the optical characteristics than if a
  nitrogen atmosphere is used; Nichia recommends using a nitrogen reflow atmosphere.
• Repairing should not be done after the LEDs have been soldered. It should be confirmed beforehand whether the characteristics
  of the LEDs will or will not be damaged by repairing.
• The Die Heat Sink should be soldered to customer PCB. If it is difficult or impossible, use high heat-dissipating adhesive.
• When soldering, do not apply stress to the LED while the LED is hot.
• When using a pick and place machine, choose an appropriate nozzle for this product.
• The soldering pad pattern above is a general recommendation for LEDs to be mounted without issues; if a high degree of precision
  is required for the chosen application (i.e. high-density mounting), ensure that the soldering pad pattern is optimized.
• When flux is used, it should be a halogen free flux. Ensure that the manufacturing process is not designed in a manner where the
  flux will come in contact with the LEDs.
• Ensure that there are no issues with the type and amount of solder that is being used