Laser Diodes Types

CW PACKAGES (see below for fibered packages, cw packages, package options)


HHL


The HHL(High Heat Load) package is the largest standard package available. It is a hermetically sealed packageapproximately 1.5" square. The package is available with astandard TEC which will stabilize the temperature of a 5 W laseror with a high performance TEC (HPTEC) when a larger temperture tuning range is required. The HHL package istypically used when there is a large heat load (>2W diode) orwhen a large temperature tuning range is desired.

This package is the preferred package for fibered applications. A modified version of this package is used for our visible modules(see fibered packages below)

Options available: Photodiode, Thermistor , FAC, Fibering , TEC, HPTEC

Package / option combinations:

HHL (HHL with no internal TEC)

HHL-FAC (HHL with fast axis collimator)

HHL-TEC (HHL with standard TEC, photodiode, thermistor)

HHL-HPTEC (HHL with high performance TEC, photodiode, thermistor, photodiode)

HHLF-TEC (Fibered HHL see fibered packages)

HHLF-HPTEC (Visible module package)

DUAL-HHLF (Visible module, 14 fibers)

T03



The TO3 is an eight pin diamond base hermetically sealedpackage. It may be used with devices up to 5W without a TEC.The TO3 package can include a standard TEC for 1W devices or a high performance TEC for 2W devices.

Options available: Photodiode, Thermistor , FAC, Fibering , TEC, HPTEC

Package / option combinations:

TO3 (TO3 with no internal TEC)

TO3-FAC (TO3 with fast axis collimator)

TO3-TEC (TO3 with standard TEC, photodiode, thermistor, 1W diode maximum)

TO3-HPTEC (TO3 with high performance TEC, photodiode, thermistor, photodiode, 2W diode maximum)

TO3F-TEC (Fibered TO3 see fibered packages)

C-Mount



The C-mount is an open package suitable for devices with up to 5W output power with suitable heatsinking. This package istypically used by OEM's who wish to take advantage of thepackage's small size and the ability to place objects such as lens very close to the laser facet. The disadvantage of thispackage is that the diode is exposed and therefore subject tomechanical damage. As a result HPD does not warrantee openpackages.

Options available: FAC

Package /option combinations:

C

C-FAC (C-mount with FAC)

9MM


The 9MM package is a sealed copper package suitable fordevices up to 2W output power. This is an ideal low cost package for mid power applications where internal cooling is notrequired. This package is also well suited for high volumeapplications.

Options available: photodiode, FAC

Package /option combinations:

9MM

9MM-D (9mm with monitor photodiode)

9MM-FAC (9mm with FAC lens)

9MM-CN (case negative for short pulse devices)

TO56


The TO56 (5.6 mm) package is a hermetically sealed steel package suitable for low power (<50mW) single mode devicessuch as HPD's 4000 series.

Options available: photodiode

Package/option combinations:

TO56

TO56-D (5.6 mm with monitor photodiode)

FIBERED PACKAGES (see also cw packages, pulsed packages, package options)


HHLF



The HHLF(High Heat Load, fibered) package is the largest fibered package available. It is a sealed package approximately1.5" square. The package is available with a standard TECwhich will stabilize the temperature of a 5 W laser or a high performance TEC (HPTEC) when a larger temperature tuning range is required. Fibered packages typically use a fiber corediameter equal to the laser source size (see data sheets) with areduction in power of approximately 30%.This package is used for visible modules (5200 and 5300 series lasers)

Options available: Photodiode, Thermistor , FAC, Fibering , TEC, HPTEC

Package / option combinations:

HHLF (HHLF with no internal TEC)

HHLF-TEC (HHLF with TEC, monitor photodiode and thermistor)

HHLF-HPTEC (Visible module package with TEC, monitor photodiode and thermistor)

DUAL-HHLF-HPTEC (Visible module package ,14 fibers, with TEC, monitor photodiode and thermistor)

HHLF Assembly Drawing (Visible module package)

T03F



The TO3F is an eight pin diamond base sealed package. It maybe used with devices up to 5W without a TEC or up to 2W with ahigh performance TEC. Fibered packages typically use a fibercore diameter equal to the laser source size (see data sheets) with a reduction in power of approximately 30%.

Options available: Photodiode, Thermistor , Fibering , TEC, HPTEC

Package / option combinations:

TO3F (TO3 with no internal TEC)

TO3F-TEC (TO3F with standard TEC, photodiode, thermistor, 1W diode maximum)

TO3F-HPTEC (TO3F with high performance TEC, photodiode, thermistor, photodiode, 2W diode maximum)

T0259


The TO259 is a three pin sealed package. It may be used with devices up to 5W. This package is available in a hermeticallysealed version. It is ideal for low cost fibered applicationswhere an internal TEC is not required.

Fibered packages typically use a fiber core diameter equal tothe laser source size (see data sheets) with a reduction in power of approximately 30%.

Options available: Photodiode, Thermistor ,

Package / option combinations:

TO259

TO259-D (TO259 with monitor photodiode)

TO259-TH (TO259 with thermistor)

BUTF


The Butterfly (BUTF) package is an industry standard 14 pinDIP package/ It may be used with devices up to 1W with a standard TEC or up to 2W with a high performance TEC. Thispackage is available in a hermetically sealed version. It is idealfor low power fibered applications where an internal TEC isrequired.

Fibered packages typically use a fiber core diameter equal tothe laser source size (see data sheets) with a reduction inpower of approximately 30%.

Options available: photodetector , thermistor , FAC, Fibering , TEC, HPTEC

Package / option combinations:

BUTF

BUTF-TEC ( BUTF with standard TEC, photodiode, thermistor, 1W diode maximum)

BUTF-HPTEC ( BUTF with high performance TEC, photodiode, thermistor, 2W diode maximum


9MM



The 9MM package is a low cost hermetically sealed package. This package is well suited for high volume applications.

Options available: photodetector , Stacks

Package /option combinations:

9MM

PULSED PACKAGES (designed for 200ns, 2kHz, low power dissipation) (see also fibered packages, cw packages, package options)

9MM-D (9mm with monitor photodiode)


TO5



The TO5 package is a two pin hermetically sealed steel packagewith the low inductance. The laser leads are isolated from thecase. The case has a threaded block for mounting purposes.

Options available: Stacks

Package /option combinations:

TO5


TO56



The TO56 (5.6 mm) package is a hermetically sealed steel package with the lowest inductance of our standard packages.

Options available: photodetector , Stacks

Package /option combinations:

TO56

TO56-D (5.6 mm with monitor photodiode)


T018


The TO18 is a hermetically sealed coaxial package with a singlelead. The threaded case makes it extremely easy to mount intoa heatsink.

Options Available: Stacks

Package /option combinations:

TO18

Package Options

(not all options are available with every package. See above for details, see also cw packages, fibered packages,


D


Monitor Photodiode: A photodiode is used to measure the light outof the laser by monitoring scattered light inside the package. Thiscan be used in a power feedback loop for CW devices and a range zero pulse for pulsed devices. Since the signal level is dependent onscattered light, the value of the responsivity in any given packagecan vary widely (see device specifications). The use of a monitor photodiode should be verified in each new application.



Detector Parameters

HPD4005 Detector Current Histogram


TH


A thermistor is a temperature measuring device which is typically used in a feedback loop to stabilize the temperature of the laser.HPD uses a NTC (negative temperature coefficient) thermistor with a 10,000 Ohm resistance at 25C.


FAC



A Fast axis colimator (FAC) is a cylindircal lens mounted directly tothe laser submount which decreases the fast axis of the laseremission from 40 degrees to approximately 2 degrees. Couplingloss through a FAC is typically 5%.


Fibering


Fibered packages typically use a fiber core diameter equal to thelaser source size (see data sheets) with a reduction in power ofapproximately 30%. Fibering provides a method of transmitting light to a remote location. It also provides a method of obtaining a uniform round beam.



TEC





Thermoelectric coolers (TEC's) are electronic devices which caneither cool or heat a device when current is applied. They are typically used in conjunction with a thermistor to stabilize thetemperature of a laser. In most laser applications the TEC is used tocool the device. In this case the hot side of the TEC (typically thelaser case) must have sufficient heatsink to remove both the heat from the laser and from the TEC.

High Performance TEC's (HPTEC) are specially manufactured toprovide greater performance from the same size device. Thesedevices are more expensive than a standard TEC but are valuable when an application requires an extended temperature tuningrange.


TEC/Thermistor parameters


#S

pulsed packages)

HPD4050 Detector Current Histogram

TEC/Thermistor Parameters

Typical Farfield of FAC

List of Standard Fibers

HPTEC vs Standard TEC performance (TO3)

Vertical Stack (2S, 3S,4S, 5S). Applies to short pulse devices only. The specified number of laser chips are stacked one on top of another to linearly increase the output power. The verticalseparation of the chips is typically 150um. Larger stack sizes mayintroduce duty cycle limitations due to thermal effects.

http://www.laserenthusiast.com/forums/showthread.php?t=464

coherent Onyx Micro Channel Cooled Package (MCCP).Single to high-density arrays from 40W to 4500W CW power.


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